（来源：广东省电路板行业协会GPCA）
11月6日，TTST泰科思特韩国子公司制造基地研究所正式开业。这是继TTST Korea工厂落地之后，TTST集团全球化布局的又一重要里程碑，标志着TTST正式迈入从中国制造到海外制造的战略升级。
On November 6, 2026, the TTST Korea Manufacturing Base & Research Institute officially opened. This marks another important milestone for TTST, following the launch of its Korea factory, and signals the company's strategic upgrade from China manufacturing to overseas manufacturing.
强化韩国本土研发
打造“中韩合作标杆”
Local R&D in Korea: Building a Benchmark for China-Korea Cooperation
TTST称，韩国是全球高端PCB、半导体与AI载板的核心产业高地。韩国工厂的落成是公司“制造走向国际”的历史性一步。面向AI算力厚板、IC载板（FC-BGA）、玻璃基载板及半导体等设备的发展需求，公司需贴近全球顶尖技术生态，因此在韩国本土建立研发中心，吸纳当地工程人才，围绕下一代先进封装和载板设备开展深度研发，推动韩国制研基地成为TTST全球技术创新的重要引擎。
Korea is a key global hub for high-end PCB, semiconductor, and AI substrate industries. The Korea factory represents a major step in TTST's global manufacturing strategy. To meet equipment requirements for AI computing thick boards,FC-BGA IC substrates,glass core substrates,and semiconductors, we need to stay close to leading technology communities. That is why we established this local R&D center in Korea and hired local engineers to develop next-generation equipments for advanced packaging and substrates. This Korean site will become an important global innovation hub for TTST.
深耕高端PCB与载板装备
推进全球化产业协同
Chinese Automated Equipment Supporting Korean Customers
TTST Korea制造基地研究所，将提供TTST全产品线的本地销售与服务，把韩国制造基地研究所的工匠精神与研发底蕴，与中国的高效制造及自动化技术相结合，共同推动全球泛半导体产业进步。
TTST Korea Manufacturing Base & Research Institute provides local sales and service for all TTST products. It combines Korea's R&D strengths with China's efficient manufacturing and automation technology to support the development of the global pan-semiconductor industry.
TTST自2018年成立以来，长期深耕HDI-mSAP、AI算力板、IC载板、玻璃基载板、先进封装、半导体领域。目前公司聚焦两大核心方向：在AI算力厚板领域：裁磨线、冲孔机、塞孔机、高纵横比电镀线、高精度压机等设备市占率领先；在细线路领域：VCP电镀线、Coreless分板机、垂直显影/蚀刻/去膜、高精度压机、ABF撕膜机、撕铜箔机、烤箱等满足前沿工艺需求。
Founded in 2018, TTST focuses on HDI-mSAP, AI computing boards, IC substrates, glass core substrates, advanced packaging, and semiconductors. The company focuses on two core technology areas:AI Computing High-Layer-Count PCBs: TTST holds a leading market position in equipment for Trimming & Grinding lines, Post-etch punching machines, and Vacuum resin plugging machines, High aspect ratio board electroplating, as well as High-precision press machine. Fine-Line Processing: TTST provides VCP plating ,Coreless detach machine and Vertical developing/etching/stripping (DES) systems、High-precision press machine, ABF peeling machine, Carrier copper foil peeling machine, Oven to meet the requirements of advanced fine-line processes.Keep innovating, improve our equipment and integrated process solutions, and steadily expand our global layout.
在AI算力、先进封装与高端载板产业加速演进的背景下，设备企业全球化正从单一产品输出转向制造、服务与研发验证的本地化协同。TTST韩国制造基地研究所的开业，意味着其正以中韩产业技术协同为支点，进一步强化面向高端PCB及半导体载板客户的全球化服务响应能力，与海内外客户伙伴抢抓AI与半导体产业发展机遇，共创产业新价值！
As AI computing, advanced packaging, and high-end substrate industries grow rapidly, equipment suppliers are moving beyond simple product sales toward local manufacturing, service, and R&D support. The opening of the TTST Korea site enables us to leverage China-Korea technical synergy and respond faster to high-end PCB and semiconductor substrate customers worldwide. We will work with all partners to capture opportunities in the AI and semiconductor sectors and create greater value together.
